Kjøpe FSAM10SM60A med BYCHPS
Kjøp med garanti
FSAM10SM60A
- Delenummer:
- FSAM10SM60A
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- SMART POWER MODULE 10A SPM32-AA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17645 Pieces
- Dataark:
- FSAM10SM60A.pdf
Introduksjon
BYCHIPS er strømprodusenten for FSAM10SM60A, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FSAM10SM60A via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 2500Vrms |
|---|---|
| Spenning: | 600V |
| Type: | IGBT |
| Serie: | SPM® |
| Pakke / tilfelle: | 32-PowerDIP Module (1.370", 34.80mm) |
| Andre navn: | FSAM10SM60A_NL FSAM10SM60A_NL-ND |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | FSAM10SM60A |
| Utvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 10A 32-PowerDIP Module (1.370", 34.80mm) |
| Beskrivelse: | SMART POWER MODULE 10A SPM32-AA |
| Nåværende: | 10A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til FSAM10SM60A
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FSAM15SH60 | Fairchild/ON Semiconductor | IC SMART POWER MOD 15A SPM32-AA | Forespørsel |
|
FSAM10SH60 | Fairchild/ON Semiconductor | IC SMART POWER MOD 10A SPM32-AA | Forespørsel |
 |
FSAM10SH60A | Fairchild/ON Semiconductor | SMART POWER MODULE 10A SPM32-AA | Forespørsel |
|
FSAM15SL60 | Fairchild/ON Semiconductor | SMART POWER MODULE 15A SPM32-AA | Forespørsel |
 |
FSAM15SH60A | Fairchild/ON Semiconductor | SMART POWER MODULE 15A SPM32-AA | Forespørsel |
 |
GA50SICP12-227 | GeneSiC Semiconductor | SIC CO-PACK SJT/RECT 50A 1.2KV | Forespørsel |
 |
FSAM15SM60A | Fairchild/ON Semiconductor | SMART POWER MODULE 15A SPM32AA | Forespørsel |
|
FSBM10SH60 | Fairchild/ON Semiconductor | IC SMART POWER MOD 10A SPM32-AA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers