Kjøpe FSBB20CH60F med BYCHPS
Kjøp med garanti
FSBB20CH60F
- Delenummer:
- FSBB20CH60F
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- IC SMART POWER MOD 20A SPM27-CA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19277 Pieces
- Dataark:
- FSBB20CH60F.pdf
Introduksjon
BYCHIPS er strømprodusenten for FSBB20CH60F, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FSBB20CH60F via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 2500Vrms |
|---|---|
| Spenning: | 600V |
| Type: | IGBT |
| Serie: | Motion-SPM® |
| Pakke / tilfelle: | 27-PowerDIP Module (1.205", 30.60mm) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | FSBB20CH60F |
| Utvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 20A 27-PowerDIP Module (1.205", 30.60mm) |
| Beskrivelse: | IC SMART POWER MOD 20A SPM27-CA |
| Nåværende: | 20A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til FSBB20CH60F
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FSBB20CH60C | Fairchild/ON Semiconductor | MODULE SPM 600V 20A SPMCC | Forespørsel |
 |
FSBB20CH60D | Fairchild/ON Semiconductor | MODULE SPM 600V 20A SPMCC | Forespørsel |
 |
FSBB20CH60 | Fairchild/ON Semiconductor | SMART POWER MODULE 20A SPM27-CA | Forespørsel |
|
FSBB20CH60L | Fairchild/ON Semiconductor | MODULE SPM 600V 20A SPM27-CB | Forespørsel |
|
FSBB20CH60BT | Fairchild/ON Semiconductor | MODULE SPM 600V 20A 3PH SPM27CC | Forespørsel |
|
FSBB20CH60B | Fairchild/ON Semiconductor | MODULE SPM 600V 20A 3PH SPM27CC | Forespørsel |
 |
FSBB20CH60CL | Fairchild/ON Semiconductor | SMART POWER MODULE 20A SPM27-CB | Forespørsel |
|
FSBB20CH60CT | Fairchild/ON Semiconductor | MODULE SPM 600V 20A SPMCC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers