Kjøpe FT234XD-R med BYCHPS
Kjøp med garanti
FT234XD-R
- Delenummer:
- FT234XD-R
- Beskrivelse:
- IC USB SERIAL BASIC UART 12DFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17759 Pieces
- Dataark:
- FT234XD-R.pdf
Introduksjon
BYCHIPS er strømprodusenten for FT234XD-R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FT234XD-R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.97 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 12-DFN (3x3) |
| Standarder: | USB 2.0 |
| Serie: | - |
| protokoll: | USB |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 12-VFDFN Exposed Pad |
| Andre navn: | 768-1178-2 FT234XDR |
| Driftstemperatur: | -40°C ~ 85°C |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | FT234XD-R |
| Interface: | UART |
| Funksjon: | Bridge, USB to UART |
| Utvidet beskrivelse: | USB Bridge, USB to UART USB 2.0 UART Interface 12-DFN (3x3) |
| Beskrivelse: | IC USB SERIAL BASIC UART 12DFN |
| Strøm - Forsyning: | 8mA |
| Email: | [email protected] |
Beslektede deler til FT234XD-R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FT234XD-T | FTDI, Future Technology Devices International Ltd | IC USB SERIAL UART 12DFN | Forespørsel |
 |
MAX3421EEHJ+TG2C | Maxim Integrated | IC USB PERIPH/HOST CNTRL TQFP | Forespørsel |
 |
KSZ9567STXI | Microchip Technology | IC ETHERNET SWITCH 7PORT 128TQFP | Forespørsel |
 |
PCI1620PDV | Texas Instruments | IC PC CARD CTLR DUAL-SKT 208LQFP | Forespørsel |
|
TUSB4041IPAPR | Texas Instruments | IC USB 2.0 4PORT HUB 64HTQFP | Forespørsel |
 |
Z16C3010VSC00TR | Zilog | IC Z16C32 MCU USC 68PLCC | Forespørsel |
|
PCI7515ZHK | Texas Instruments | IC PC CARD CONTROLLER 257-BGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers