Kjøpe FVE015520E3R00KE med BYCHPS
Kjøp med garanti
FVE015520E3R00KE
- Delenummer:
- FVE015520E3R00KE
- Produsent:
- Mills / Vishay
- Beskrivelse:
- RES CHAS MNT 3 OHM 10% 155W
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17392 Pieces
- Dataark:
- FVE015520E3R00KE.pdf
Introduksjon
BYCHIPS er strømprodusenten for FVE015520E3R00KE, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FVE015520E3R00KE via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±10% |
|---|---|
| Temperaturkoeffisient: | ±400ppm/°C |
| Størrelse / Dimensjon: | 1.125" Dia x 4.500" L (28.58mm x 114.30mm) |
| Serie: | FVE |
| Motstand (ohm): | 3 |
| Strøm (Watts): | 155W |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Tubular |
| Andre navn: | FVE-155-3 FVE-155-3-ND FVE015506E3R00KE FVE015506E3R00KE-ND FVE155-3 Q1664616 |
| Driftstemperatur: | -55°C ~ 350°C |
| Monteringsfunksjon: | Brackets (not included) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | FVE015520E3R00KE |
| Lead Style: | Solder Lugs |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Strykprosent: | - |
| Beskrivelse: | RES CHAS MNT 3 OHM 10% 155W |
| sammensetning: | Wirewound |
| Belegg, Boligtype: | Vitreous Enamel Coated |
| Email: | [email protected] |
Beslektede deler til FVE015520E3R00KE
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers