Kjøpe FZ30R07W1E3B31ABOMA1 med BYCHPS
Kjøp med garanti
FZ30R07W1E3B31ABOMA1
- Delenummer:
- FZ30R07W1E3B31ABOMA1
- Beskrivelse:
- IGBT MODULES
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16707 Pieces
- Dataark:
- FZ30R07W1E3B31ABOMA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for FZ30R07W1E3B31ABOMA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FZ30R07W1E3B31ABOMA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Andre navn: | SP000884588 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | FZ30R07W1E3B31ABOMA1 |
| Utvidet beskrivelse: | IGBT Module |
| Beskrivelse: | IGBT MODULES |
| Email: | [email protected] |
Beslektede deler til FZ30R07W1E3B31ABOMA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
IXA90IF650NA | IXYS | IGBT 650V 90A SOT-227B | Forespørsel |
 |
APTGF100DU120TG | Microsemi Corporation | IGBT MODULE NPT DUAL 1200V SP4 | Forespørsel |
 |
VS-GA200SA60UP | Vishay Semiconductor Diodes Division | IGBT 600V 200A 500W SOT-227 | Forespørsel |
|
APTGV50H60BG | Microsemi Corporation | IGBT NPT BST CHOP FULL BRDG SP4 | Forespørsel |
 |
CM200DY-34A | Powerex Inc. | IGBT MOD DUAL 1700V 200A A SER | Forespørsel |
 |
MG12300D-BN2MM | Littelfuse Inc. | IGBT MODULE PACKAGE D1200V 300A | Forespørsel |
 |
IXXN110N65C4H1 | IXYS | IGBT 650V 210A 750W SOT227B | Forespørsel |
|
VS-GB300LH120N | Vishay Semiconductor Diodes Division | IGBT 1200V 500A 1645W INT-A-PAK | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers