Kjøpe GA400TD25S med BYCHPS
Kjøp med garanti
GA400TD25S
- Delenummer:
- GA400TD25S
- Produsent:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- IGBT FAST 250V 400A INT-A-PAK
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 16740 Pieces
- Dataark:
- GA400TD25S.pdf
Introduksjon
BYCHIPS er strømprodusenten for GA400TD25S, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GA400TD25S via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 250V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 1.6V @ 15V, 400A |
| Leverandør Enhetspakke: | Dual INT-A-PAK |
| Serie: | - |
| Strøm - Maks: | 1350W |
| Pakke / tilfelle: | Dual INT-A-PAK (3 + 8) |
| Andre navn: | *GA400TD25S VS-GA400TD25S VS-GA400TD25S-ND VSGA400TD25S VSGA400TD25S-ND |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | GA400TD25S |
| Input Kapasitans (Cies) @ Vce: | 36nF @ 30V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Half Bridge 250V 400A 1350W Chassis Mount Dual INT-A-PAK |
| Beskrivelse: | IGBT FAST 250V 400A INT-A-PAK |
| Gjeldende - Samler Cutoff (Maks): | 500µA |
| Nåværende - Samler (Ic) (Maks): | 400A |
| konfigurasjon: | Half Bridge |
| Email: | [email protected] |
Beslektede deler til GA400TD25S
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CM150DX-24A | Powerex Inc. | IGBT MOD DUAL 1200V 150A NX SER | Forespørsel |
 |
APTGF50H60T3G | Microsemi Corporation | POWER MODULE IGBT 600V 50A SP3 | Forespørsel |
 |
APTGF25DDA120T3G | Microsemi Corporation | IGBT MODULE NPT DL BST CHOP SP3 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog