Kjøpe GB100XCP12-227 med BYCHPS
Kjøp med garanti
GB100XCP12-227
- Delenummer:
- GB100XCP12-227
- Produsent:
- GeneSiC Semiconductor
- Beskrivelse:
- IGBT 1200V 100A SOT-227
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13987 Pieces
- Dataark:
- GB100XCP12-227.pdf
Introduksjon
BYCHIPS er strømprodusenten for GB100XCP12-227, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GB100XCP12-227 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2V @ 15V, 100A |
| Leverandør Enhetspakke: | SOT-227 |
| Serie: | - |
| Strøm - Maks: | - |
| Pakke / tilfelle: | SOT-227-4 |
| Andre navn: | 1242-1142 GB100XCP12227 |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 18 Weeks |
| Produsentens varenummer: | GB100XCP12-227 |
| Input Kapasitans (Cies) @ Vce: | 8.55nF @ 25V |
| Input: | Standard |
| IGBT Type: | PT |
| Utvidet beskrivelse: | IGBT Module PT Single 1200V 100A Chassis Mount SOT-227 |
| Beskrivelse: | IGBT 1200V 100A SOT-227 |
| Gjeldende - Samler Cutoff (Maks): | 1mA |
| Nåværende - Samler (Ic) (Maks): | 100A |
| konfigurasjon: | Single |
| Email: | [email protected] |
Beslektede deler til GB100XCP12-227
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CM400DU-12NFH | Powerex Inc. | IGBT MOD DUAL 600V 400A NFH SER | Forespørsel |
 |
CM20TF-12H | Powerex Inc. | IGBT MOD 6PAC 600V 20A H SER | Forespørsel |
 |
IRG7T400SD12B | Infineon Technologies | MOD IGBT 1200V 400A POWIR 62 | Forespørsel |
 |
FMG2G400LS60 | Fairchild/ON Semiconductor | IGBT POWER MOD 600V 300A 7PM-IA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers