Kjøpe GOLDELOX med BYCHPS
Kjøp med garanti
GOLDELOX
- Delenummer:
- GOLDELOX
- Produsent:
- 4D Systems
- Beskrivelse:
- IC GRAPHICS CTLR GOLDELOX 28QFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14216 Pieces
- Dataark:
- 1.GOLDELOX.pdf2.GOLDELOX.pdf
Introduksjon
BYCHIPS er strømprodusenten for GOLDELOX, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GOLDELOX via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 28-QFN (6x6) |
| Serie: | - |
| RAM-størrelse: | 510 x 8 |
| Programminnetype: | FLASH (10 kB) |
| emballasje: | Cut Strip |
| Pakke / tilfelle: | 28-VQFN Exposed Pad |
| Andre navn: | 1613-1002 |
| Driftstemperatur: | -40°C ~ 80°C |
| Antall I / O: | 2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | GOLDELOX |
| Interface: | LCD, OLED, SD/SDHC, SPI, TFT, UART |
| Beskrivelse: | IC GRAPHICS CTLR GOLDELOX 28QFN |
| Kjerneprosessor: | EVE |
| Controller Series: | - |
| applikasjoner: | Graphics Processor |
| Email: | [email protected] |
Beslektede deler til GOLDELOX
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CY8C20646A-24LQXIT | Cypress Semiconductor Corp | IC CAPSENSE 1.8V 36 I/O 48-QFN | Forespørsel |
 |
CY7C66013C-PVXC | Cypress Semiconductor Corp | IC MCU 8K USB HUB 4 PORT 48SSOP | Forespørsel |
|
CY7C64613-128NC | Cypress Semiconductor Corp | IC MCU USB EZ FX 8K RAM 128BQFP | Forespørsel |
 |
NET+40-QINRO-4 | Digi International | IC MPU 32B 33MHZ LINUX 208QFP | Forespørsel |
 |
CY7C64013-SC | Cypress Semiconductor Corp | IC MCU 8K FULL SPEED USB 28SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers