Kjøpe GSID200A120S5C1 med BYCHPS
Kjøp med garanti
GSID200A120S5C1
- Delenummer:
- GSID200A120S5C1
- Produsent:
- Global Power Technologies Group
- Beskrivelse:
- IGBT MODULE 1200V 335A
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12826 Pieces
- Dataark:
- GSID200A120S5C1.pdf
Introduksjon
BYCHIPS er strømprodusenten for GSID200A120S5C1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GSID200A120S5C1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.1V @ 15V, 200A |
| Leverandør Enhetspakke: | Module |
| Serie: | - |
| Pakke / tilfelle: | Module |
| Andre navn: | 1560-1231 |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC-termistor: | Yes |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 4 Weeks |
| Produsentens varenummer: | GSID200A120S5C1 |
| Input Kapasitans (Cies) @ Vce: | 22.4nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Three Phase Inverter 1200V 335A Chassis Mount Module |
| Beskrivelse: | IGBT MODULE 1200V 335A |
| Gjeldende - Samler Cutoff (Maks): | 1mA |
| Nåværende - Samler (Ic) (Maks): | 335A |
| konfigurasjon: | Three Phase Inverter |
| Email: | [email protected] |
Beslektede deler til GSID200A120S5C1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
VS-EMG050J60N | Vishay Semiconductor Diodes Division | IGBT 600V 88A 338W EMIPAK2 | Forespørsel |
 |
APTGT50TDU60PG | Microsemi Corporation | IGBT MOD TRIPLE DUAL SOURCE SP6P | Forespørsel |
 |
HGT1N30N60A4D | Fairchild/ON Semiconductor | IGBT SMPS N-CHAN 600V SOT-227 | Forespørsel |
 |
CM600HB-24A | Powerex Inc. | IGBT MOD SGL 1200V 600A A SER | Forespørsel |
|
APTGT30X60T3G | Microsemi Corporation | IGBT MOD TRENCH 3PH BRIDGE SP3 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers