Kjøpe GXE3R501 med BYCHPS
Kjøp med garanti
GXE3R501
- Delenummer:
- GXE3R501
- Produsent:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 1-3.5PF 300V THRU HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19251 Pieces
- Dataark:
- GXE3R501.pdf
Introduksjon
BYCHIPS er strømprodusenten for GXE3R501, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GXE3R501 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 300V |
|---|---|
| Størrelse / Dimensjon: | 0.291" L x 0.264" W (7.40mm x 6.70mm) |
| Serie: | - |
| emballasje: | Bulk |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | GXE3R501 |
| Høyde - sittende (maks): | 0.315" (8.00mm) |
| Egenskaper: | General Purpose |
| Utvidet beskrivelse: | 1 ~ 3.5pF Trimmer Capacitor 300V Top and Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 1-3.5PF 300V THRU HOLE |
| Kapasitansområde: | 1 ~ 3.5pF |
| Justeringstype: | Top and Bottom Adjustment |
| Email: | [email protected] |
Beslektede deler til GXE3R501
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
GMC41500 | Sprague-Goodman | CAP TRIM 420-1400PF 175V T/H | Forespørsel |
|
GXE3R511 | Sprague-Goodman | CAP TRIM 1-3.5PF 300V THRU HOLE | Forespørsel |
|
GMA41500 | Sprague-Goodman | CAP TRIM 420-1400PF 175V T/H | Forespørsel |
 |
TZB4P300AB10R00 | Murata Electronics North America | CAP TRIMMER 6.5-30PF 100V SMD | Forespørsel |
|
GMD30700 | Sprague-Goodman | CAP TRIM 75-300PF 175V THRU HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers