Kjøpe GXR36000 med BYCHPS
Kjøp med garanti
GXR36000
- Delenummer:
- GXR36000
- Produsent:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 4.5-36PF 200V THRU HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19320 Pieces
- Dataark:
- GXR36000.pdf
Introduksjon
BYCHIPS er strømprodusenten for GXR36000, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GXR36000 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 200V |
|---|---|
| Størrelse / Dimensjon: | 0.449" L x 0.310" W (11.40mm x 7.90mm) |
| Serie: | - |
| emballasje: | Bulk |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | GXR36000 |
| Høyde - sittende (maks): | 0.335" (8.50mm) |
| Egenskaper: | General Purpose |
| Utvidet beskrivelse: | 4.5 ~ 36pF Trimmer Capacitor 200V Side Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 4.5-36PF 200V THRU HOLE |
| Kapasitansområde: | 4.5 ~ 36pF |
| Justeringstype: | Side Adjustment |
| Email: | [email protected] |
Beslektede deler til GXR36000
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SGNMNC3806 | Sprague-Goodman | CAP TRIM 5-85PF 6KV CHASS MNT | Forespørsel |
 |
0538-011-B-2.5-11LF | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Forespørsel |
 |
GMA41000 | Sprague-Goodman | CAP TRIM 260-900PF 175V T/H | Forespørsel |
|
GQP5R500 | Sprague-Goodman | CAP TRIMMER SMD | Forespørsel |
|
GFC16000 | Sprague-Goodman | CAP TRIM 1-16PF 750V THRU HOLE | Forespørsel |
|
GXF25000 | Sprague-Goodman | CAP TRIM 3-25PF 200V THRU HOLE | Forespørsel |
|
0538-011-F-15.0-60 | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Forespørsel |
|
GDT20031 | Sprague-Goodman | CAP TRIM 1.5-20PF 250V SURF MNT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers