Kjøpe GZC43112 med BYCHPS
Kjøp med garanti
GZC43112
- Delenummer:
- GZC43112
- Produsent:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 30-430PF 100V THRU HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17010 Pieces
- Dataark:
- GZC43112.pdf
Introduksjon
BYCHIPS er strømprodusenten for GZC43112, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GZC43112 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 100V |
|---|---|
| Størrelse / Dimensjon: | 0.510" L x 0.449" W (13.00mm x 11.40mm) |
| Serie: | FILMTRIM® |
| emballasje: | Bulk |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | GZC43112 |
| Høyde - sittende (maks): | 0.571" (14.50mm) |
| Egenskaper: | General Purpose |
| Utvidet beskrivelse: | 30 ~ 430pF Trimmer Capacitor 100V Top and Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 30-430PF 100V THRU HOLE |
| Kapasitansområde: | 30 ~ 430pF |
| Justeringstype: | Top and Bottom Adjustment |
| Email: | [email protected] |
Beslektede deler til GZC43112
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
GHN11031 | Sprague-Goodman | CAP TRIM 0.8-11PF 750V SURF MNT | Forespørsel |
 |
BFC280908002 | Vishay BC Components | CAP TRIM 4-38PF 250V THRU HOLE | Forespørsel |
|
GME90501 | Sprague-Goodman | CAP TRIM 95-230PF 2KV PNL MOUNT | Forespørsel |
|
GER90000 | Sprague-Goodman | CAP TRIMMER TH | Forespørsel |
|
GMD31500 | Sprague-Goodman | CAP TRIM 240-700PF 175V T/H | Forespørsel |
|
GXE5R002 | Sprague-Goodman | CAP TRIM 1.5-5PF 200V THRU HOLE | Forespørsel |
|
GMD30000 | Sprague-Goodman | CAP TRIM 2.5-12PF 175V THRU HOLE | Forespørsel |
|
BFC280909002 | Vishay BC Components | CAP TRIM 2-9PF 250V THRU HOLE | Forespørsel |
|
GDT40031 | Sprague-Goodman | CAP TRIM 1.5-40PF 250V SURF MNT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers