Kjøpe GZP60100 med BYCHPS
Kjøp med garanti
GZP60100
- Delenummer:
- GZP60100
- Produsent:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 25-600PF 150V THRU HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15438 Pieces
- Dataark:
- GZP60100.pdf
Introduksjon
BYCHIPS er strømprodusenten for GZP60100, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for GZP60100 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 150V |
|---|---|
| Størrelse / Dimensjon: | 0.670" L x 0.610" W (17.00mm x 15.50mm) |
| Serie: | - |
| emballasje: | Bulk |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | GZP60100 |
| Høyde - sittende (maks): | 0.709" (18.00mm) |
| Egenskaper: | General Purpose |
| Utvidet beskrivelse: | 25 ~ 600pF Trimmer Capacitor 150V Side Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 25-600PF 150V THRU HOLE |
| Kapasitansområde: | 25 ~ 600pF |
| Justeringstype: | Side Adjustment |
| Email: | [email protected] |
Beslektede deler til GZP60100
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
GXF75000 | Sprague-Goodman | CAP TRIM 6-75PF 200V THRU HOLE | Forespørsel |
|
GWL2R500 | Sprague-Goodman | CAP TRIM 0.4-2.5PF 500V SURF MNT | Forespørsel |
 |
SGNMNC3806E | Sprague-Goodman | CAP TRIM 5-85PF 6KV CHASS MNT | Forespørsel |
|
SGNMNC2406E | Sprague-Goodman | CAP TRIM 4-40PF 6KV CHASS MNT | Forespørsel |
|
GMC30100 | Sprague-Goodman | CAP TRIM 3.5-25PF 175V THRU HOLE | Forespørsel |
|
PC52J5R5 | Sprague-Goodman | CAP TRIMMER 0.8-5.5PF 750V T/H | Forespørsel |
|
GWF8R000 | Sprague-Goodman | CAP TRIM 0.8-8PF 500V | Forespørsel |
 |
NMAJ25HV | Knowles Voltronics | CAP TRIMMER 1-23PF 750V SMD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers