Kjøpe HB1850-2R5806-R med BYCHPS
Kjøp med garanti
HB1850-2R5806-R
- Delenummer:
- HB1850-2R5806-R
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 80F -10% +30% 2.5V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13309 Pieces
- Dataark:
- HB1850-2R5806-R.pdf
Introduksjon
BYCHIPS er strømprodusenten for HB1850-2R5806-R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HB1850-2R5806-R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | -10%, +30% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | - |
| Serie: | PowerStor HB |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 23 Weeks |
| Produsentens varenummer: | HB1850-2R5806-R |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Utvidet beskrivelse: | 80F -10%, +30%(EDLC) Supercapacitor 2.5V Radial, Can 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | - |
| Beskrivelse: | CAP 80F -10% +30% 2.5V T/H |
| kapasitans: | 80F |
| Email: | [email protected] |
Beslektede deler til HB1850-2R5806-R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BCAP3400 P285 K05 | Maxwell Technologies Inc. | CAP 3400F 2.85V WELD | Forespørsel |
 |
SCCS30B106SRB | AVX Corporation | CAPACITOR 10F 2.7V THRU HOLE | Forespørsel |
 |
MAL219613473E3 | Vishay BC Components | CAP 47MF -20%, +80% 6.3V T/H | Forespørsel |
 |
106DER2R5STV | Illinois Capacitor | CAP 10F -20%, +50% 2.5V T/H | Forespørsel |
 |
EEC-HW0D475 | Panasonic Electronic Components | CAP 4.7F -20% +40% 2.3V T/H | Forespørsel |
 |
BMOD0083 P048 B01 | Maxwell Technologies Inc. | CAP 83F 48V CHASSIS MOUNT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers