Kjøpe HFB095051-100 med BYCHPS
Kjøp med garanti
HFB095051-100
- Delenummer:
- HFB095051-100
- Beskrivelse:
- FERRITE CORE 64 OHM SOLID 5.08MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12123 Pieces
Introduksjon
BYCHIPS er strømprodusenten for HFB095051-100, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HFB095051-100 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | HF |
| rangeringer: | - |
| Ytre dimensjon: | 0.375" Dia (9.52mm) |
| Andre navn: | 240-2145 HFB095051100 |
| Monteringstype: | Free Hanging |
| Materiale: | HF |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | HFB095051-100 |
| Lengde: | 0.394" (10.00mm) |
| Innvendig dimensjon: | 0.200" Dia (5.08mm) |
| Impedans @ Frekvens: | 64 Ohm @ 300MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 64 Ohm @ 300MHz ID 0.200" Dia (5.08mm) OD 0.375" Dia (9.52mm) Length 0.394" (10.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 64 OHM SOLID 5.08MM |
| Email: | [email protected] |
Beslektede deler til HFB095051-100
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
HFB095051-200 | Laird-Signal Integrity Products | FERRITE CORE 120 OHM SOLID | Forespørsel |
 |
ZCAT4625-3430D | TDK Corporation | FERRITE CORE 35 OHM HINGED | Forespørsel |
 |
HFB095052-100 | Laird-Signal Integrity Products | FERRITE CORE HINGED | Forespørsel |
 |
742700727 | Wurth Electronics Inc. | FERRITE CORE 115 OHM SOLID 4.2MM | Forespørsel |
 |
28R1953-000 | Laird-Signal Integrity Products | FERRITE CORE 127 OHM SOLID | Forespørsel |
 |
ESD-SR-100 | KEMET | FERRITE CORE HINGED 6MM | Forespørsel |
|
28B1387-000 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog