Kjøpe HHXA630ARA330MHA0G med BYCHPS
Kjøp med garanti
HHXA630ARA330MHA0G
- Delenummer:
- HHXA630ARA330MHA0G
- Produsent:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM POLY HYB 33UF 63V SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19498 Pieces
Introduksjon
BYCHIPS er strømprodusenten for HHXA630ARA330MHA0G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HHXA630ARA330MHA0G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 63V |
|---|---|
| Type: | Hybrid |
| Toleranse: | ±20% |
| Surface Mount Land Size: | 0.327" L x 0.327" W (8.30mm x 8.30mm) |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | HXA |
| Ripple Current - Lavfrekvens: | - |
| Ripple Current - High Frequency: | 1.1A @ 100kHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Radial, Can - SMD |
| Andre navn: | 565-4171-2 HHXA630ARA330MHA0G-ND |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | HHXA630ARA330MHA0G |
| Levetid @ Temp.: | 4000 Hrs @ 125°C |
| Lead Spacing: | - |
| impedans: | - |
| Høyde - sittende (maks): | 0.406" (10.30mm) |
| Utvidet beskrivelse: | 33µF ±20% 63V Aluminum Polymer Capacitor Radial, Can - SMD 40 mOhm 4000 Hrs @ 125°C |
| ESR (ekvivalent serieresistens): | 40 mOhm |
| Beskrivelse: | CAP ALUM POLY HYB 33UF 63V SMD |
| kapasitans: | 33µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til HHXA630ARA330MHA0G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers