Kjøpe HS8.2 med BYCHPS
Kjøp med garanti
Introduksjon
BYCHIPS er strømprodusenten for HS8.2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HS8.2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| spesifikasjoner: | 2.2° C/W |
|---|---|
| Serie: | HS |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | HS8.2 |
| For bruk med / relaterte produkter: | Multiple Series |
| Utvidet beskrivelse: | Heat Sink Multiple Series |
| Beskrivelse: | HEATSINK SSR 45MM 2.2DEG C/W DIN |
| Farge: | - |
| Tilbehørstype: | Heat Sink |
| Email: | [email protected] |
Beslektede deler til HS8.2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CNS128900 | Amphenol PCD | SOCKET CONTACT SZ12/12 | Forespørsel |
 |
R99-07G5D | Omron Automation and Safety | E-BRACKET FOR G7L | Forespørsel |
 |
84145051 | Crouzet | SIMM JUMPER PLUG 2 POSITION | Forespørsel |
 |
PFC-A1 | Omron Automation and Safety | CLIP HOLD-DOWN FOR MK SER | Forespørsel |
 |
HS8.3 | Crydom Co. | HEATSINK SSR 45MM 3.5DEG C/W DIN | Forespørsel |
 |
HS8.1 | Crydom Co. | HEATSINK SSR 2.0 DEG C/W PNL MT | Forespørsel |
 |
P2RV-S | Omron Automation and Safety | SEPARATOR PLATE DIN HV FOR G2RV | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers