Kjøpe HV0820-2R7305-AP med BYCHPS
Kjøp med garanti
HV0820-2R7305-AP
- Delenummer:
- HV0820-2R7305-AP
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 3F -10% +30% 2.7V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18659 Pieces
- Dataark:
- HV0820-2R7305-AP.pdf
Introduksjon
BYCHIPS er strømprodusenten for HV0820-2R7305-AP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HV0820-2R7305-AP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | -10%, +30% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | PowerStor HV |
| emballasje: | Tape & Box (TB) |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | HV0820-2R7305-AP |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.138" (3.50mm) |
| Høyde - sittende (maks): | 0.827" (21.00mm) |
| Utvidet beskrivelse: | 3F -10%, +30%(EDLC) Supercapacitor 2.7V Radial, Can 80 mOhm @ 100Hz 1000 Hrs @ 65°C |
| ESR (ekvivalent serieresistens): | 80 mOhm @ 100Hz |
| Beskrivelse: | CAP 3F -10% +30% 2.7V T/H |
| kapasitans: | 3F |
| Email: | [email protected] |
Beslektede deler til HV0820-2R7305-AP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B0820-2R5225 | Eaton | CAP 2.2F -20% +80% 2.5V T/H | Forespørsel |
 |
HV0820-2R7305-R | Eaton | CAP 3F -10% +30% 2.7V T/H | Forespørsel |
 |
EEC-RG0V155H | Panasonic Electronic Components | CAP 1.5F 3.6V T/H | Forespørsel |
 |
A1020-2R5105-AP | Eaton | CAP 1F -20%, +80% 2.5V THRU HOLE | Forespørsel |
 |
PAS0815LN2R7205 | Taiyo Yuden | CAP 2F 20% 2.7V THROUGH HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog