Kjøpe HV1325-2R7156-R med BYCHPS
Kjøp med garanti
HV1325-2R7156-R
- Delenummer:
- HV1325-2R7156-R
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 15F -10% +30% 2.7V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16235 Pieces
- Dataark:
- HV1325-2R7156-R.pdf
Introduksjon
BYCHIPS er strømprodusenten for HV1325-2R7156-R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HV1325-2R7156-R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | -10%, +30% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.512" Dia (13.00mm) |
| Serie: | PowerStor HV |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 283-4196 HV13252R7156R |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 23 Weeks |
| Produsentens varenummer: | HV1325-2R7156-R |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Høyde - sittende (maks): | 1.118" (28.40mm) |
| Utvidet beskrivelse: | 15F -10%, +30%(EDLC) Supercapacitor 2.7V Radial, Can 30 mOhm @ 100Hz 1000 Hrs @ 65°C |
| ESR (ekvivalent serieresistens): | 30 mOhm @ 100Hz |
| Beskrivelse: | CAP 15F -10% +30% 2.7V T/H |
| kapasitans: | 15F |
| Email: | [email protected] |
Beslektede deler til HV1325-2R7156-R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SCCR20B335SRB | AVX Corporation | CAPACITOR 3.3F 2.7V THRU HOLE | Forespørsel |
 |
2.7DMC4.7FMEFC10X23 | Rubycon | CAP 4.7F 20% 2.7V THROUGH HOLE | Forespørsel |
 |
S501DC107W2R7A | KEMET | CAP 100F 0% +20% 2.7V T/H | Forespørsel |
 |
DZ-2R5D106Z7T | Elna America | CAP 10F -20% +80% 2.5V T/H | Forespørsel |
 |
MAL219691262E3 | Vishay BC Components | CAP ALUM 15F 2.8V SNAP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers