Kjøpe IDC05S60CEX1SA1 med BYCHPS
Kjøp med garanti
IDC05S60CEX1SA1
- Delenummer:
- IDC05S60CEX1SA1
- Beskrivelse:
- DIODE SIC 600V 5A SAWN WAFER
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18244 Pieces
- Dataark:
- IDC05S60CEX1SA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IDC05S60CEX1SA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IDC05S60CEX1SA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.7V @ 5A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 600V |
| Leverandør Enhetspakke: | Die |
| Hastighet: | No Recovery Time > 500mA (Io) |
| Serie: | thinQ!™ |
| Omvendt gjenopprettingstid (trr): | 0ns |
| emballasje: | Bulk |
| Pakke / tilfelle: | Die |
| Andre navn: | SP000599924 |
| Driftstemperatur - Kobling: | -55°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IDC05S60CEX1SA1 |
| Utvidet beskrivelse: | Diode Silicon Carbide Schottky 600V 5A (DC) Surface Mount Die |
| Diodetype: | Silicon Carbide Schottky |
| Beskrivelse: | DIODE SIC 600V 5A SAWN WAFER |
| Strøm - Omvendt lekkasje @ Vr: | 70µA @ 600V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 5A (DC) |
| Kapasitans @ Vr, F: | 240pF @ 1V, 1MHz |
| Email: | [email protected] |
Beslektede deler til IDC05S60CEX1SA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers