Kjøpe IDV03S60CXKSA1 med BYCHPS
Kjøp med garanti
IDV03S60CXKSA1
- Delenummer:
- IDV03S60CXKSA1
- Beskrivelse:
- DIODE SCHOTTKY 600V 3A TO220-2FP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16077 Pieces
- Dataark:
- IDV03S60CXKSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IDV03S60CXKSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IDV03S60CXKSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.9V @ 3A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 600V |
| Leverandør Enhetspakke: | PG-TO220-2 Full Pack |
| Hastighet: | No Recovery Time > 500mA (Io) |
| Serie: | thinQ!™ |
| Omvendt gjenopprettingstid (trr): | 0ns |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-220-2 Full Pack |
| Andre navn: | IDT03S60C IDT03S60C-ND IDV03S60C IDV03S60C-ND SP000274985 SP000732198 |
| Driftstemperatur - Kobling: | -55°C ~ 175°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IDV03S60CXKSA1 |
| Utvidet beskrivelse: | Diode Silicon Carbide Schottky 600V 3A (DC) Through Hole PG-TO220-2 Full Pack |
| Diodetype: | Silicon Carbide Schottky |
| Beskrivelse: | DIODE SCHOTTKY 600V 3A TO220-2FP |
| Strøm - Omvendt lekkasje @ Vr: | 30µA @ 600V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 3A (DC) |
| Kapasitans @ Vr, F: | 90pF @ 1V, 1MHz |
| Email: | [email protected] |
Beslektede deler til IDV03S60CXKSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers