Kjøpe IHW30N135R3FKSA1 med BYCHPS
Kjøp med garanti
IHW30N135R3FKSA1
- Delenummer:
- IHW30N135R3FKSA1
- Beskrivelse:
- IGBT 1350V 60A 349W TO247-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16209 Pieces
- Dataark:
- IHW30N135R3FKSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IHW30N135R3FKSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IHW30N135R3FKSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1350V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 1.85V @ 15V, 30A |
| Testtilstand: | 600V, 30A, 10 Ohm, 15V |
| Td (på / av) @ 25 ° C: | -/337ns |
| Bytte energi: | 1.93mJ (off) |
| Leverandør Enhetspakke: | PG-TO247-3 |
| Serie: | TrenchStop® |
| Strøm - Maks: | 349W |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-247-3 |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | IHW30N135R3FKSA1 |
| Inngangstype: | Standard |
| IGBT Type: | Trench |
| Gate Charge: | 263nC |
| Utvidet beskrivelse: | IGBT Trench 1350V 60A 349W Through Hole PG-TO247-3 |
| Beskrivelse: | IGBT 1350V 60A 349W TO247-3 |
| Nåværende - Samlerpulserte (Icm): | 90A |
| Nåværende - Samler (Ic) (Maks): | 60A |
| Email: | [email protected] |
Beslektede deler til IHW30N135R3FKSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers