Kjøpe IMT18T110 med BYCHPS
Kjøp med garanti
IMT18T110
- Delenummer:
- IMT18T110
- Produsent:
- LAPIS Semiconductor
- Beskrivelse:
- TRANS 2PNP 12V 0.5A 6SMT
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19000 Pieces
- Dataark:
- IMT18T110.pdf
Introduksjon
BYCHIPS er strømprodusenten for IMT18T110, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IMT18T110 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 12V |
|---|---|
| Vce Metning (Maks) @ Ib, Ic: | 250mV @ 10mA, 200mA |
| Transistor Type: | 2 PNP (Dual) |
| Leverandør Enhetspakke: | SMT6 |
| Serie: | - |
| Strøm - Maks: | 300mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SC-74, SOT-457 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | IMT18T110 |
| Frekvens - Overgang: | 260MHz |
| Utvidet beskrivelse: | Bipolar (BJT) Transistor Array 2 PNP (Dual) 12V 500mA 260MHz 300mW Surface Mount SMT6 |
| Beskrivelse: | TRANS 2PNP 12V 0.5A 6SMT |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 270 @ 10mA, 2V |
| Gjeldende - Samler Cutoff (Maks): | 100nA (ICBO) |
| Nåværende - Samler (Ic) (Maks): | 500mA |
| Email: | [email protected] |
Beslektede deler til IMT18T110
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BC858CDXV6T5 | ON Semiconductor | TRANS 2PNP 30V 0.1A SOT563 | Forespørsel |
 |
MMPQ3904 | Fairchild/ON Semiconductor | TRANS 4NPN 40V 0.2A 16SOIC | Forespørsel |
 |
BC817DS,115 | Nexperia USA Inc. | TRANS 2NPN 45V 0.5A 6TSOP | Forespørsel |
 |
BCV62CE6327HTSA1 | Infineon Technologies | TRANS 2PNP 30V 0.1A SOT143 | Forespørsel |
|
PBSS4160DSH | Nexperia USA Inc. | TRANS 2NPN 60V 0.87A SC-74 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers