Kjøpe IRAM336-025SB3 med BYCHPS
Kjøp med garanti
IRAM336-025SB3
- Delenummer:
- IRAM336-025SB3
- Beskrivelse:
- IC HYBRID MULTI-CHIP 500V 2A
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12656 Pieces
- Dataark:
- IRAM336-025SB3.pdf
Introduksjon
BYCHIPS er strømprodusenten for IRAM336-025SB3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IRAM336-025SB3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | - |
|---|---|
| Spenning: | 500V |
| Type: | MOSFET |
| Serie: | - |
| Pakke / tilfelle: | 19-PowerSSIP Module, Formed Leads |
| Andre navn: | SP001544658 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IRAM336-025SB3 |
| Utvidet beskrivelse: | Power Driver Module MOSFET 3 Phase 500V 2A 19-PowerSSIP Module, Formed Leads |
| Beskrivelse: | IC HYBRID MULTI-CHIP 500V 2A |
| Nåværende: | 2A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til IRAM336-025SB3
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
IRAM336-025SB | Infineon Technologies | IC HYBRID 3PH INV 2A 500V SIP-S | Forespørsel |
 |
IKCM15F60GAXKMA1 | Infineon Technologies | IFPS MODULES | Forespørsel |
 |
PS21997-4A | Powerex Inc. | MOD DIPIPM 30A 600V SUPER MINI | Forespørsel |
 |
PSS30S71F6 | Powerex Inc. | MOD IPM 6-PAC 30A 600V DIP | Forespørsel |
 |
STIPN2M50T-H | STMicroelectronics | POWER DRVR MOD 500V 2A 26DIP MOD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers