Kjøpe IRL3705NL med BYCHPS
Kjøp med garanti
IRL3705NL
- Delenummer:
- IRL3705NL
- Beskrivelse:
- MOSFET N-CH 55V 89A TO-262
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 18498 Pieces
- Dataark:
- IRL3705NL.pdf
Introduksjon
BYCHIPS er strømprodusenten for IRL3705NL, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IRL3705NL via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 2V @ 250µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | TO-262 |
| Serie: | HEXFET® |
| Rds På (Maks) @ Id, Vgs: | 10 mOhm @ 46A, 10V |
| Strømdissipasjon (maks): | 3.8W (Ta), 170W (Tc) |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-262-3 Long Leads, I²Pak, TO-262AA |
| Andre navn: | *IRL3705NL |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IRL3705NL |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 3600pF @ 25V |
| Gateavgift (Qg) (Maks) @ Vgs: | 98nC @ 5V |
| FET Type: | N-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | N-Channel 55V 89A (Tc) 3.8W (Ta), 170W (Tc) Through Hole TO-262 |
| Drain til Source Voltage (VDSS): | 55V |
| Beskrivelse: | MOSFET N-CH 55V 89A TO-262 |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 89A (Tc) |
| Email: | [email protected] |
Beslektede deler til IRL3705NL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers