Kjøpe IXBN42N170A med BYCHPS
Kjøp med garanti
IXBN42N170A
- Delenummer:
- IXBN42N170A
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IC TRANS BIPO 1700V SOT-227
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12663 Pieces
- Dataark:
- IXBN42N170A.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXBN42N170A, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXBN42N170A via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1700V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 6V @ 15V, 21A |
| Leverandør Enhetspakke: | SOT-227B |
| Serie: | BIMOSFET™ |
| Strøm - Maks: | 312W |
| Pakke / tilfelle: | SOT-227-4, miniBLOC |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | IXBN42N170A |
| Input Kapasitans (Cies) @ Vce: | 3.5nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Single 1700V 42A 312W Chassis Mount SOT-227B |
| Beskrivelse: | IC TRANS BIPO 1700V SOT-227 |
| Gjeldende - Samler Cutoff (Maks): | 50µA |
| Nåværende - Samler (Ic) (Maks): | 42A |
| konfigurasjon: | Single |
| Email: | [email protected] |
Beslektede deler til IXBN42N170A
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
APTGT50DSK120T3G | Microsemi Corporation | IGBT MOD TRENCH DL BUCK CHOP SP3 | Forespørsel |
 |
CM600DU-24F | Powerex Inc. | IGBT MOD DUAL 1200V 600A F SER | Forespørsel |
|
APTGT75SK120T1G | Microsemi Corporation | IGBT 1200V 110A 357W SP1 | Forespørsel |
|
APTGT300SK120G | Microsemi Corporation | IGBT 1200V 420A 1380W SP6 | Forespørsel |
 |
APT60GT60JR | Microsemi Corporation | IGBT 600V 93A 378W SOT227 | Forespørsel |
 |
MWI225-12E9 | IXYS | MOD IGBT SIXPACK E+ | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog