Kjøpe IXGE200N60B med BYCHPS
Kjøp med garanti
IXGE200N60B
- Delenummer:
- IXGE200N60B
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V ISOPLUS227
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12726 Pieces
- Dataark:
- IXGE200N60B.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXGE200N60B, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXGE200N60B via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.3V @ 15V, 120A |
| Leverandør Enhetspakke: | ISOPLUS220™ |
| Serie: | HiPerFAST™ |
| Strøm - Maks: | 416W |
| Pakke / tilfelle: | ISOPLUS227™ |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IXGE200N60B |
| Input Kapasitans (Cies) @ Vce: | 11nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Single 600V 160A 416W Chassis Mount ISOPLUS220™ |
| Beskrivelse: | IGBT 600V ISOPLUS227 |
| Gjeldende - Samler Cutoff (Maks): | 200µA |
| Nåværende - Samler (Ic) (Maks): | 160A |
| konfigurasjon: | Single |
| Email: | [email protected] |
Beslektede deler til IXGE200N60B
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CM200DY-24NF | Powerex Inc. | IGBT MOD DUAL 1200V 200A NF SER | Forespørsel |
 |
MUBW30-12E6K | IXYS | MODULE IGBT CBI E1 | Forespørsel |
 |
CM600DU-24NFH | Powerex Inc. | IGBT MOD DUAL 1200V 600A NFH SER | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers