Kjøpe IXGR60N60C2G1 med BYCHPS
Kjøp med garanti
IXGR60N60C2G1
- Delenummer:
- IXGR60N60C2G1
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V 75A ISOPLUS247
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16007 Pieces
- Dataark:
- IXGR60N60C2G1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXGR60N60C2G1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXGR60N60C2G1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | - |
| Testtilstand: | - |
| Td (på / av) @ 25 ° C: | - |
| Bytte energi: | - |
| Leverandør Enhetspakke: | ISOPLUS247™ |
| Serie: | - |
| Strøm - Maks: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | ISOPLUS247™ |
| Driftstemperatur: | - |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IXGR60N60C2G1 |
| Inngangstype: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT 600V 75A Through Hole ISOPLUS247™ |
| Beskrivelse: | IGBT 600V 75A ISOPLUS247 |
| Nåværende - Samlerpulserte (Icm): | - |
| Nåværende - Samler (Ic) (Maks): | 75A |
| Email: | [email protected] |
Beslektede deler til IXGR60N60C2G1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
IXGR60N60C3D1 | IXYS | IGBT 600V 75A 170W ISOPLUS247 | Forespørsel |
 |
IXGR60N60B2D1 | IXYS | IGBT 600V 75A 250W ISOPLUS247 | Forespørsel |
|
IXGR60N60C2 | IXYS | IGBT 600V 75A 250W ISOPLUS247 | Forespørsel |
|
IXGR60N60U1 | IXYS | IGBT 600V 75A 300W ISOPLUS247 | Forespørsel |
|
IXGR60N60C2D1 | IXYS | IGBT 600V 75A 250W ISOPLUS247 | Forespørsel |
|
IXGR60N60C3C1 | IXYS | IGBT 600V 75A 170W ISOPLUS247 | Forespørsel |
|
IXGR60N60B2 | IXYS | IGBT 600V 75A 250W ISOPLUS247 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers