Kjøpe IXGX64N60B3D1 med BYCHPS
Kjøp med garanti
IXGX64N60B3D1
- Delenummer:
- IXGX64N60B3D1
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V 460W PLUS247
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13142 Pieces
- Dataark:
- IXGX64N60B3D1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXGX64N60B3D1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXGX64N60B3D1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 1.8V @ 15V, 50A |
| Testtilstand: | 480V, 50A, 3 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 25ns/138ns |
| Bytte energi: | 1.5mJ (on), 1mJ (off) |
| Leverandør Enhetspakke: | PLUS247™-3 |
| Serie: | GenX3™ |
| Omvendt gjenopprettingstid (trr): | 35ns |
| Strøm - Maks: | 460W |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-247-3 |
| Driftstemperatur: | - |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | IXGX64N60B3D1 |
| Inngangstype: | Standard |
| IGBT Type: | PT |
| Gate Charge: | 168nC |
| Utvidet beskrivelse: | IGBT PT 600V 460W Through Hole PLUS247™-3 |
| Beskrivelse: | IGBT 600V 460W PLUS247 |
| Nåværende - Samlerpulserte (Icm): | 400A |
| Nåværende - Samler (Ic) (Maks): | - |
| Email: | [email protected] |
Beslektede deler til IXGX64N60B3D1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog