Kjøpe IXSP20N60B2D1 med BYCHPS
Kjøp med garanti
IXSP20N60B2D1
- Delenummer:
- IXSP20N60B2D1
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V 35A 190W TO220
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14474 Pieces
- Dataark:
- IXSP20N60B2D1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXSP20N60B2D1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXSP20N60B2D1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.5V @ 15V, 16A |
| Testtilstand: | 480V, 16A, 10 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 30ns/116ns |
| Bytte energi: | 380µJ (off) |
| Leverandør Enhetspakke: | TO-220AB |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 30ns |
| Strøm - Maks: | 190W |
| emballasje: | Bulk |
| Pakke / tilfelle: | TO-220-3 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Produsentens varenummer: | IXSP20N60B2D1 |
| Inngangstype: | Standard |
| IGBT Type: | PT |
| Gate Charge: | 33nC |
| Utvidet beskrivelse: | IGBT PT 600V 35A 190W Through Hole TO-220AB |
| Beskrivelse: | IGBT 600V 35A 190W TO220 |
| Nåværende - Samlerpulserte (Icm): | 60A |
| Nåværende - Samler (Ic) (Maks): | 35A |
| Email: | [email protected] |
Beslektede deler til IXSP20N60B2D1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers