Kjøpe JDP2S08SC(TPL3) med BYCHPS
Kjøp med garanti
JDP2S08SC(TPL3)
- Delenummer:
- JDP2S08SC(TPL3)
- Produsent:
- Toshiba Semiconductor
- Beskrivelse:
- DIODE PIN 30V 50MA SC2
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14393 Pieces
- Dataark:
- JDP2S08SC(TPL3).pdf
Introduksjon
BYCHIPS er strømprodusenten for JDP2S08SC(TPL3), vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for JDP2S08SC(TPL3) via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 30V |
|---|---|
| Leverandør Enhetspakke: | SC2 |
| Serie: | - |
| Motstand @ Hvis, F: | 1.5 Ohm @ 10mA, 100MHz |
| Strømdissipasjon (maks): | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 2-SMD, No Lead |
| Andre navn: | JDP2S08SC(TPL3)TR JDP2S08SCTPL3 |
| Driftstemperatur: | 150°C (TJ) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | JDP2S08SC(TPL3) |
| Utvidet beskrivelse: | RF Diode PIN - Single 30V 50mA SC2 |
| Diodetype: | PIN - Single |
| Beskrivelse: | DIODE PIN 30V 50MA SC2 |
| Nåværende - Maks: | 50mA |
| Kapasitans @ Vr, F: | 0.4pF @ 1V, 1MHz |
| Email: | [email protected] |
Beslektede deler til JDP2S08SC(TPL3)
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SMP1371-087LF | Skyworks Solutions Inc. | DIODE PIN 35V 200MA 2QFN | Forespørsel |
 |
JDP2S12CR(TE85L,Q | Toshiba Semiconductor and Storage | DIODE PIN 180V 1A S-FLAT | Forespørsel |
 |
BAP50-03,115 | NXP USA Inc. | DIODE PIN GP 50V 50MA SOD-323 | Forespørsel |
 |
JDP2S02AFS(TPL3) | Toshiba Semiconductor and Storage | DIODE PIN 30V 50MA FSC | Forespørsel |
 |
JDP2S02ACT(TPL3) | Toshiba Semiconductor and Storage | DIODE PIN 30V 50MA CTS2 | Forespørsel |
 |
MA4P7006F-1072T | M/A-Com Technology Solutions | DIODE PIN SMQ CERAMIC SI | Forespørsel |
|
MA4P504-1072T | M/A-Com Technology Solutions | DIODE PIN SMQ CERAMIC SI | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog