Kjøpe JMK316BJ106ML-T med BYCHPS
Kjøp med garanti
JMK316BJ106ML-T
- Delenummer:
- JMK316BJ106ML-T
- Produsent:
- Taiyo Yuden
- Beskrivelse:
- CAP ,MLCC ,1206,6.3V,X7R,10UF20%
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15373 Pieces
Introduksjon
BYCHIPS er strømprodusenten for JMK316BJ106ML-T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for JMK316BJ106ML-T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Andre navn: | 587-5447-2 CE JMK316 BJ106ML-T |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | JMK316BJ106ML-T |
| Utvidet beskrivelse: | Ceramic Capacitor |
| Beskrivelse: | CAP ,MLCC ,1206,6.3V,X7R,10UF20% |
| Email: | [email protected] |
Beslektede deler til JMK316BJ106ML-T
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
JMK316BJ106MD-T | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
 |
JMK316BJ106MLHT | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
|
JMK316BJ107ML-T | Taiyo Yuden | CAP CER 100UF 6.3V X5R 1206 | Forespørsel |
|
JMK316BJ106KL-T | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
|
JMK316BJ106KD-T | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
|
JMK316BJ106MF-T | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
|
JMK316BJ106KF-T | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
|
JMK316BJ106KLHT | Taiyo Yuden | CAP CER 10UF 6.3V X5R 1206 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers