Kjøpe KBPM306G med BYCHPS
Kjøp med garanti
KBPM306G
- Delenummer:
- KBPM306G
- Produsent:
- GeneSiC Semiconductor
- Beskrivelse:
- DIODE BRIDGE 600V 3A KBPM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17004 Pieces
- Dataark:
- 1.KBPM306G.pdf2.KBPM306G.pdf
Introduksjon
BYCHIPS er strømprodusenten for KBPM306G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for KBPM306G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 600V |
|---|---|
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.1V @ 3A |
| Teknologi: | Standard |
| Leverandør Enhetspakke: | KBPM |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | 4-SIP, KBPM |
| Andre navn: | KBPM306GGN |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | KBPM306G |
| Utvidet beskrivelse: | Bridge Rectifier Single Phase 600V 3A Through Hole KBPM |
| Diodetype: | Single Phase |
| Beskrivelse: | DIODE BRIDGE 600V 3A KBPM |
| Strøm - Omvendt lekkasje @ Vr: | 5µA @ 50V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 3A |
| Email: | [email protected] |
Beslektede deler til KBPM306G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers