Kjøpe KR16TB251512B1 med BYCHPS
Kjøp med garanti
KR16TB251512B1
- Delenummer:
- KR16TB251512B1
- Produsent:
- Panasonic
- Beskrivelse:
- FERRITE CORE 80 OHM CLAMP 13.4MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15251 Pieces
- Dataark:
- KR16TB251512B1.pdf
Introduksjon
BYCHIPS er strømprodusenten for KR16TB251512B1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for KR16TB251512B1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | TB |
| rangeringer: | - |
| Ytre dimensjon: | 1.161" Dia (29.50mm) |
| Andre navn: | P11401 |
| Monteringstype: | Chassis Mount |
| Materiale: | - |
| Produsentens varenummer: | KR16TB251512B1 |
| Lengde: | 0.531" (13.50mm) |
| Innvendig dimensjon: | 0.527" Dia (13.40mm) |
| Impedans @ Frekvens: | 80 Ohm @ 100MHz |
| Utvidet beskrivelse: | Clamp Chassis Mount Ferrite Core 80 Ohm @ 100MHz ID 0.527" Dia (13.40mm) OD 1.161" Dia (29.50mm) Length 0.531" (13.50mm) |
| Design: | Clamp |
| Beskrivelse: | FERRITE CORE 80 OHM CLAMP 13.4MM |
| Email: | [email protected] |
Beslektede deler til KR16TB251512B1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
74270037 | Wurth Electronics Inc. | FERRITE CORE 199 OHM SOLID 5.6MM | Forespørsel |
 |
782013125285 | Wurth Electronics Inc. | FERRITE CORE 240 OHM SOLID 13MM | Forespørsel |
 |
28R1799-010 | Laird-Signal Integrity Products | FERRITE CORE 172 OHM SOLID | Forespørsel |
 |
HFA187102-0A2 | Laird-Signal Integrity Products | FERRITE CORE 220 OHM HINGED | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers