Kjøpe KSR-2R8334-R med BYCHPS
Kjøp med garanti
KSR-2R8334-R
- Delenummer:
- KSR-2R8334-R
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 330MF -20% +80% 2.8V SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19132 Pieces
- Dataark:
- KSR-2R8334-R.pdf
Introduksjon
BYCHIPS er strømprodusenten for KSR-2R8334-R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for KSR-2R8334-R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.8V |
|---|---|
| Toleranse: | -20%, +80% |
| Avslutning: | Solder Tabs |
| Størrelse / Dimensjon: | 0.268" Dia (6.80mm) |
| Serie: | PowerStor KSR |
| emballasje: | Bulk |
| Pakke / tilfelle: | Coin, Thin Terminals - Same Sides |
| Andre navn: | 283-3018 KSR2R8334R |
| Driftstemperatur: | -10°C ~ 60°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | KSR-2R8334-R |
| Levetid @ Temp.: | 1000 Hrs @ 60°C |
| Lead Spacing: | - |
| Høyde - sittende (maks): | 0.071" (1.80mm) |
| Utvidet beskrivelse: | 330mF -20%, +80%(EDLC) Supercapacitor 2.8V Coin, Thin Terminals - Same Sides 200 Ohm @ 1kHz 1000 Hrs @ 60°C |
| ESR (ekvivalent serieresistens): | 200 Ohm @ 1kHz |
| Beskrivelse: | CAP 330MF -20% +80% 2.8V SMD |
| kapasitans: | 330mF |
| Email: | [email protected] |
Beslektede deler til KSR-2R8334-R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
KS-3R3224-R | Eaton | CAP 220MF -20% +80% 3.3V SMD | Forespørsel |
 |
EEC-S5R5V105 | Panasonic Electronic Components | CAP 1F -20% +80% 5.5V T/H | Forespørsel |
 |
KSR-3R3204-R | Eaton | CAP 200MF -20% +80% 3.3V SMD | Forespørsel |
 |
EEC-S0HD223H | Panasonic Electronic Components | CAP 22MF -20% +80% 5.5V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers