Kjøpe KUMP-11D18-24 med BYCHPS
Kjøp med garanti
KUMP-11D18-24
- Delenummer:
- KUMP-11D18-24
- Beskrivelse:
- RELAY GEN PURPOSE DPDT 15A 24V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS-kompatibel
- Tilgjengelig mengde:
- 12190 Pieces
- Dataark:
- KUMP-11D18-24.pdf
Introduksjon
BYCHIPS er strømprodusenten for KUMP-11D18-24, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for KUMP-11D18-24 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 18 VDC |
|---|---|
| Slå av spenning (Min): | - |
| Oppsigelsesstil: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Bryter spenning: | 277VAC - Max |
| Serie: | KUMP |
| Frigjør tid: | 10ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | 7-1393116-2 KUMP11D1824 PB618 |
| Driftstemperatur: | -45°C ~ 70°C |
| Bruk tid: | 15ms |
| Monteringstype: | Socketable |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | KUMP-11D18-24 |
| Egenskaper: | Insulation - Class B |
| Utvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) 24VDC Coil Socketable |
| Beskrivelse: | RELAY GEN PURPOSE DPDT 15A 24V |
| Kontakt Rating (Nåværende): | 15A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontakt skjema: | DPDT (2 Form C) |
| Spolespenning: | 24VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 472 Ohms |
| Coil Power: | 1.25 W |
| Coil Current: | 51mA |
| Email: | [email protected] |
Beslektede deler til KUMP-11D18-24
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog