Kjøpe KUP-11D55-110 med BYCHPS
Kjøp med garanti
KUP-11D55-110
- Delenummer:
- KUP-11D55-110
- Beskrivelse:
- RELAY GEN PURPOSE DPDT 10A 110V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS-kompatibel
- Tilgjengelig mengde:
- 16627 Pieces
- Dataark:
- KUP-11D55-110.pdf
Introduksjon
BYCHIPS er strømprodusenten for KUP-11D55-110, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for KUP-11D55-110 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 82.5 VDC |
|---|---|
| Slå av spenning (Min): | - |
| Oppsigelsesstil: | Quick Connect - 0.187" (4.7mm) |
| Bryter spenning: | 240VAC - Max |
| Serie: | KUP |
| Frigjør tid: | 10ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | 5-1393117-5 5-1393117-5-ND 513931175 KUP-11D55-110-ND PB1469 |
| Driftstemperatur: | -45°C ~ 70°C |
| Bruk tid: | 15ms |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | KUP-11D55-110 |
| Egenskaper: | Insulation - Class B |
| Utvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) 110VDC Coil Chassis Mount |
| Beskrivelse: | RELAY GEN PURPOSE DPDT 10A 110V |
| Kontakt Rating (Nåværende): | 10A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontakt skjema: | DPDT (2 Form C) |
| Spolespenning: | 110VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 10 kOhms |
| Coil Power: | 1.25 W |
| Coil Current: | 11mA |
| Email: | [email protected] |
Beslektede deler til KUP-11D55-110
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers