Kjøpe LDEEE3470KA5N00 med BYCHPS
Kjøp med garanti
LDEEE3470KA5N00
- Delenummer:
- LDEEE3470KA5N00
- Produsent:
- KEMET
- Beskrivelse:
- CAP FILM 0.47UF 10% 100VDC 2824
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13541 Pieces
Introduksjon
BYCHIPS er strømprodusenten for LDEEE3470KA5N00, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LDEEE3470KA5N00 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 100V |
|---|---|
| Spenningsverdier - AC: | 63V |
| Toleranse: | ±10% |
| Avslutning: | Solder Pads |
| Størrelse / Dimensjon: | 0.287" L x 0.240" W (7.30mm x 6.10mm) |
| Serie: | LDE |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 2824 (7260 Metric) |
| Andre navn: | 399-6427-2 DEEE3470KA5N00 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 21 Weeks |
| Produsentens varenummer: | LDEEE3470KA5N00 |
| Lead Spacing: | - |
| Høyde - sittende (maks): | 0.122" (3.10mm) |
| Egenskaper: | High Temperature |
| Utvidet beskrivelse: | 0.47µF ±10% Film Capacitor 63V 100V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 2824 (7260 Metric) |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Beskrivelse: | CAP FILM 0.47UF 10% 100VDC 2824 |
| kapasitans: | 0.47µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til LDEEE3470KA5N00
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers