Kjøpe LF3J3PAK med BYCHPS
Kjøp med garanti
LF3J3PAK
- Delenummer:
- LF3J3PAK
- Produsent:
- Littelfuse
- Beskrivelse:
- FUSE CLIP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17022 Pieces
- Dataark:
- LF3J3PAK.pdf
Introduksjon
BYCHIPS er strømprodusenten for LF3J3PAK, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LF3J3PAK via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | LF3J3PAK |
| Beskrivelse: | FUSE CLIP |
| Email: | [email protected] |
Beslektede deler til LF3J3PAK
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
0853.0576 | Schurter Inc. | COVER REFLOW W/CLAMP PCB 5X20MM | Forespørsel |
 |
2905584 | Phoenix Contact | SPARK GAP | Forespørsel |
 |
4400.042 | Schurter Inc. | KNURLED NUT CIRCUIT BRKR NICKEL | Forespørsel |
 |
913-774 | Littelfuse Inc. | ISO/MINI TERMINAL/ 3.32 5 | Forespørsel |
 |
2A1630-10 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørsel |
|
0913774001 | Littelfuse Inc. | ISO MINI TERMINAL 3.32-5.37M | Forespørsel |
|
J-13 | Eaton | FUSE REDUCER | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers