Kjøpe LH25060PC med BYCHPS
Kjøp med garanti
LH25060PC
- Delenummer:
- LH25060PC
- Produsent:
- Littelfuse
- Beskrivelse:
- FUSE BLOCK COVER ACS 60A 250V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 15190 Pieces
- Dataark:
- LH25060PC.pdf
Introduksjon
BYCHIPS er strømprodusenten for LH25060PC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LH25060PC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | - |
|---|---|
| Andre navn: | LH25060-PC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | LH25060PC |
| For bruk med / relaterte produkter: | Fuseholder; LH25060, LR25060 |
| Beskrivelse: | FUSE BLOCK COVER ACS 60A 250V |
| Tilbehørstype: | Cap (Cover) |
| Email: | [email protected] |
Beslektede deler til LH25060PC
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
LH250603C | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250603S | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250601C | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250602CR | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250602S | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250601CR | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250602C | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250303P | Littelfuse Inc. | FUSE BLOCK CART 250V 30A CHASSIS | Forespørsel |
|
LH250303PR | Littelfuse Inc. | FUSE BLOCK CART 250V 30A CHASSIS | Forespørsel |
|
LH250601S | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
|
LH250603CR | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers