Kjøpe LRC-LRF3WLF-01-R003J med BYCHPS
Kjøp med garanti
LRC-LRF3WLF-01-R003J
- Delenummer:
- LRC-LRF3WLF-01-R003J
- Produsent:
- IRC / TT Electronics
- Beskrivelse:
- RES SMD 0.003 OHM 3W 2512 WIDE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19639 Pieces
- Dataark:
- LRC-LRF3WLF-01-R003J.pdf
Introduksjon
BYCHIPS er strømprodusenten for LRC-LRF3WLF-01-R003J, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LRC-LRF3WLF-01-R003J via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±5% |
|---|---|
| Temperaturkoeffisient: | ±550ppm/°C |
| Leverandør Enhetspakke: | 1225 |
| Størrelse / Dimensjon: | 0.125" L x 0.250" W (3.18mm x 6.35mm) |
| Serie: | LRF3W |
| Motstand (ohm): | 0.003 |
| Strøm (Watts): | 3W |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Wide 2512 (6432 Metric), 1225 |
| Andre navn: | 4545060893 989-1069-2 LRC-LRF3WLF-01-R003-J LRCLRF3WLF01R003J |
| Driftstemperatur: | -55°C ~ 150°C |
| Antall oppsigelser: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | LRC-LRF3WLF-01-R003J |
| Høyde - sittende (maks): | 0.037" (0.94mm) |
| Egenskaper: | Automotive AEC-Q200, Current Sense, Moisture Resistant |
| Strykprosent: | - |
| Utvidet beskrivelse: | 0.003 Ohm ±5% 3W Chip Resistor Wide 2512 (6432 Metric), 1225 Automotive AEC-Q200, Current Sense, Moisture Resistant Thick Film |
| Beskrivelse: | RES SMD 0.003 OHM 3W 2512 WIDE |
| sammensetning: | Thick Film |
| Email: | [email protected] |
Beslektede deler til LRC-LRF3WLF-01-R003J
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers