Kjøpe LRU663 med BYCHPS
Kjøp med garanti
LRU663
- Delenummer:
- LRU663
- Produsent:
- Littelfuse
- Beskrivelse:
- FUSE REDUCER CLASS H 60 TO 30A
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13852 Pieces
- Dataark:
- LRU663.pdf
Introduksjon
BYCHIPS er strømprodusenten for LRU663, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LRU663 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Andre navn: | LRU663LF LRU663LF-ND |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | LRU663 |
| Beskrivelse: | FUSE REDUCER CLASS H 60 TO 30A |
| Email: | [email protected] |
Beslektede deler til LRU663
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
1-1423696-8 | TE Connectivity Potter & Brumfield Relays | NAMEPLATE | Forespørsel |
 |
00970023Z | Littelfuse Inc. | FUSE TRI-PULLER ACS | Forespørsel |
 |
2A1959-3 | Eaton | SKIRT FOR QSCP 13" | Forespørsel |
|
0HBF0001ZXSEALY | Littelfuse Inc. | CABLE SEAL 6MM2 FOR BF1 HOLDER | Forespørsel |
|
BK/GMT-Y | Eaton | FUSE COVER FOR GMT WITH TAB | Forespørsel |
|
LRU663R | Littelfuse Inc. | FUSE REDUCER CLASS R 60 TO 30A | Forespørsel |
|
2A1667-20 | Eaton | ASSEMBLY WITH LOUVERS 50IN FLLUS | Forespørsel |
|
270303 | Eaton | STIRUP ASSY NI PL 7.5 MIC | Forespørsel |
|
LRU663M | Littelfuse Inc. | FUSE REDUCER CLASS H 60 TO 30A | Forespørsel |
|
2A1907-2 | Eaton | KIT GROUND ISOLATED | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers