Kjøpe LT8302ES8E#TRPBF med BYCHPS
Kjøp med garanti
LT8302ES8E#TRPBF
- Delenummer:
- LT8302ES8E#TRPBF
- Produsent:
- L
- Beskrivelse:
- IC REG FLYBCK INV ISO 3.6A 8SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13200 Pieces
- Dataark:
- LT8302ES8E#TRPBF.pdf
Introduksjon
BYCHIPS er strømprodusenten for LT8302ES8E#TRPBF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LT8302ES8E#TRPBF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Utgang (Min / Fast): | - |
|---|---|
| Spenning - utgang (maks): | - |
| Spenning - Inngang (Min): | 2.8V |
| Spenning - Inngang (Maks): | 42V |
| topologi: | Flyback |
| Synkron Likner: | No |
| Leverandør Enhetspakke: | 8-SOIC-EP |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Utgangstype: | - |
| Utgangskonfigurasjon: | Positive or Negative, Isolation Capable |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| Antall utganger: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | LT8302ES8E#TRPBF |
| Funksjon: | Step-Up/Step-Down |
| Frekvens - Bytte: | Down to 12kHz |
| Utvidet beskrivelse: | Flyback Switching Regulator IC Positive or Negative, Isolation Capable 1 Output 3.6A 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Beskrivelse: | IC REG FLYBCK INV ISO 3.6A 8SOIC |
| Strøm - Utgang: | 3.6A |
| Email: | [email protected] |
Beslektede deler til LT8302ES8E#TRPBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers