Kjøpe MAL213819331E3 med BYCHPS
Kjøp med garanti
MAL213819331E3
- Delenummer:
- MAL213819331E3
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP ALUM 330UF 20% 100V AXIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16329 Pieces
- Dataark:
- MAL213819331E3.pdf
Introduksjon
BYCHIPS er strømprodusenten for MAL213819331E3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAL213819331E3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 100V |
|---|---|
| Toleranse: | ±20% |
| Surface Mount Land Size: | - |
| Størrelse / Dimensjon: | 0.709" Dia x 1.181" L (18.00mm x 30.00mm) |
| Serie: | 138 AML |
| Ripple Current: | 880mA @ 100Hz |
| polarisering: | Polar |
| emballasje: | Bulk |
| Pakke / tilfelle: | Axial, Can |
| Andre navn: | 2222 138 19331 222213819331 4261PHBK MAL213819331 |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | MAL213819331E3 |
| Levetid @ Temp.: | 10000 Hrs @ 105°C |
| Lead Spacing: | - |
| impedans: | 270 mOhm |
| Høyde - sittende (maks): | - |
| Utvidet beskrivelse: | 330µF 100V Aluminum Capacitors Axial, Can 380 mOhm @ 100Hz 10000 Hrs @ 105°C |
| ESR (ekvivalent serieresistens): | 380 mOhm @ 100Hz |
| Beskrivelse: | CAP ALUM 330UF 20% 100V AXIAL |
| kapasitans: | 330µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til MAL213819331E3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers