Kjøpe MAL213963221E3 med BYCHPS
Kjøp med garanti
MAL213963221E3
- Delenummer:
- MAL213963221E3
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP ALUM 220UF 20% 6.3V SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12027 Pieces
- Dataark:
- MAL213963221E3.pdf
Introduksjon
BYCHIPS er strømprodusenten for MAL213963221E3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAL213963221E3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 6.3V |
|---|---|
| Toleranse: | ±20% |
| Surface Mount Land Size: | 0.563" L x 0.299" W (14.30mm x 7.60mm) |
| Størrelse / Dimensjon: | 0.563" L x 0.299" W (14.30mm x 7.60mm) |
| Serie: | 139 CLL |
| Ripple Current: | 120mA |
| polarisering: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard SMD |
| Andre navn: | 2222 139 63221 222213963221 BC1178TR |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | MAL213963221E3 |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | - |
| impedans: | 1.4 Ohm |
| Høyde - sittende (maks): | 0.323" (8.20mm) |
| Utvidet beskrivelse: | 220µF 6.3V Aluminum Capacitors Nonstandard SMD 1.7 Ohm 2000 Hrs @ 105°C |
| ESR (ekvivalent serieresistens): | 1.7 Ohm |
| Beskrivelse: | CAP ALUM 220UF 20% 6.3V SMD |
| kapasitans: | 220µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til MAL213963221E3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers