Kjøpe MAL804324051E3 med BYCHPS
Kjøp med garanti
MAL804324051E3
- Delenummer:
- MAL804324051E3
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- MNT BRACKET FOR ROUND CAN TYPES
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17884 Pieces
- Dataark:
- MAL804324051E3.pdf
Introduksjon
BYCHIPS er strømprodusenten for MAL804324051E3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAL804324051E3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| spesifikasjoner: | Screw Clamp Type Bracket |
|---|---|
| Serie: | - |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | MAL804324051E3 |
| For bruk med / relaterte produkter: | Round Can Types |
| Enhetsstørrelse: | 1.969" Dia (50.0mm) |
| Beskrivelse: | MNT BRACKET FOR ROUND CAN TYPES |
| Tilbehørstype: | Mounting Bracket |
| Email: | [email protected] |
Beslektede deler til MAL804324051E3
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MAL804324921E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørsel |
|
MAL804324041E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørsel |
|
MAL804324061E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørsel |
|
MAL804324031E3 | Vishay BC Components | MNT BRACKETP FOR ROUND CAN TYPES | Forespørsel |
|
MAL804323321E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørsel |
|
MAL804320381E3 | Vishay BC Components | INSULAT DISK FOR STUD MNT TYPES | Forespørsel |
|
MAL804324011E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørsel |
|
MAL804324021E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørsel |
|
MAL804320391E3 | Vishay BC Components | INSULAT DISK FOR STUD MNT TYPES | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers