Kjøpe MAX5136AGTG+ med BYCHPS
Kjøp med garanti
MAX5136AGTG+
- Delenummer:
- MAX5136AGTG+
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC DAC 16BIT DUAL 8LSB 24-TQFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16080 Pieces
Introduksjon
BYCHIPS er strømprodusenten for MAX5136AGTG+, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAX5136AGTG+ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning, Digital: | 2.7 V ~ 5.25 V |
|---|---|
| Spenning - Tilførsel, Analog: | 2.7 V ~ 5.25 V |
| Leverandør Enhetspakke: | 24-TQFN (4x4) |
| Settling Time: | 5µs (Typ) |
| Serie: | - |
| Referansetype: | External, Internal |
| emballasje: | Tray |
| Pakke / tilfelle: | 24-WFQFN Exposed Pad |
| Utgangstype: | Voltage - Buffered |
| Driftstemperatur: | -40°C ~ 105°C |
| Antall D / A-omformere: | 2 |
| Antall bit: | 16 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | MAX5136AGTG+ |
| INL / DNL (LSB): | ±2, ±1 (Max) |
| Utvidet beskrivelse: | 16 Bit Digital to Analog Converter 2 24-TQFN (4x4) |
| Differensiell utgang: | No |
| Beskrivelse: | IC DAC 16BIT DUAL 8LSB 24-TQFN |
| Datagrensesnitt: | SPI, DSP |
| Arkitektur: | String DAC |
| Email: | [email protected] |
Beslektede deler til MAX5136AGTG+
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers