Kjøpe MAX5491RC02500+T med BYCHPS
Kjøp med garanti
MAX5491RC02500+T
- Delenummer:
- MAX5491RC02500+T
- Produsent:
- Maxim Integrated
- Beskrivelse:
- RES NTWRK 2 RES MULT OHM TO236-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14336 Pieces
- Dataark:
- MAX5491RC02500+T.pdf
Introduksjon
BYCHIPS er strømprodusenten for MAX5491RC02500+T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAX5491RC02500+T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | - |
|---|---|
| Temperaturkoeffisient: | ±35ppm/°C |
| Leverandør Enhetspakke: | SOT-23-3 |
| Størrelse / Dimensjon: | 0.115" L x 0.051" W (2.92mm x 1.30mm) |
| Serie: | MAX5491 |
| Motstand (ohm): | 8.571k, 21.43k |
| Kraft per element: | 87.5mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Andre navn: | MAX5491RC02500+ MAX5491RC02500+TTR MAX5491RC02500+TTR-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall motstandere: | 2 |
| Antall pinner: | 3 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MAX5491RC02500+T |
| Høyde - sittende (maks): | 0.044" (1.12mm) |
| Utvidet beskrivelse: | 8.571k, 21.43k Ohm 87.5mW Power Per Element Voltage Divider Resistor Network/Array ±35ppm/°C TO-236-3, SC-59, SOT-23-3 |
| Beskrivelse: | RES NTWRK 2 RES MULT OHM TO236-3 |
| Kretskort: | Voltage Divider |
| applikasjoner: | Voltage Divider (TCR Matched) |
| Email: | [email protected] |
Beslektede deler til MAX5491RC02500+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers