Kjøpe MBRB25H60CTHE3_A/I med BYCHPS
Kjøp med garanti
MBRB25H60CTHE3_A/I
- Delenummer:
- MBRB25H60CTHE3_A/I
- Produsent:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE ARRAY SCHOTTKY 60V TO263-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18946 Pieces
- Dataark:
- MBRB25H60CTHE3_A/I.pdf
Introduksjon
BYCHIPS er strømprodusenten for MBRB25H60CTHE3_A/I, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MBRB25H60CTHE3_A/I via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 600mV @ 15A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 60V |
| Leverandør Enhetspakke: | TO-263AB |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | Automotive, AEC-Q101 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Driftstemperatur - Kobling: | -65°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 34 Weeks |
| Produsentens varenummer: | MBRB25H60CTHE3_A/I |
| Utvidet beskrivelse: | Diode Array 1 Pair Common Cathode Schottky 60V 15A Surface Mount TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Diodetype: | Schottky |
| Diode Konfigurasjon: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE ARRAY SCHOTTKY 60V TO263-3 |
| Strøm - Omvendt lekkasje @ Vr: | 100µA @ 60V |
| Gjeldende - Gjennomsnittlig Rectified (Io) (per diode): | 15A |
| Email: | [email protected] |
Beslektede deler til MBRB25H60CTHE3_A/I
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers