Kjøpe MC14490DWR2G med BYCHPS
Kjøp med garanti
MC14490DWR2G
- Delenummer:
- MC14490DWR2G
- Produsent:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC ELIMINATOR BOUNCE HEX 16-SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17478 Pieces
- Dataark:
- MC14490DWR2G.pdf
Introduksjon
BYCHIPS er strømprodusenten for MC14490DWR2G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MC14490DWR2G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 3 V ~ 18 V |
|---|---|
| Leverandør Enhetspakke: | 16-SOIC |
| Serie: | 4000 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 16-SOIC (0.295", 7.50mm Width) |
| Andre navn: | MC14490DWR2G-ND MC14490DWR2GOSTR |
| Driftstemperatur: | -55°C ~ 125°C |
| Antall bit: | 6 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 5 Weeks |
| Produsentens varenummer: | MC14490DWR2G |
| Logikk Type: | Contact Bounce Eliminator |
| Utvidet beskrivelse: | Contact Bounce Eliminator IC 16-SOIC |
| Beskrivelse: | IC ELIMINATOR BOUNCE HEX 16-SOIC |
| Email: | [email protected] |
Beslektede deler til MC14490DWR2G
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MC14490F | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørsel |
 |
MC14490PG | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16DIP | Forespørsel |
|
MC14490FG | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørsel |
|
MC14490DWG | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16SOIC | Forespørsel |
|
MC14490DWR2 | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16-SOIC | Forespørsel |
|
MC14490FELG | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørsel |
|
MC14490FEL | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers